arrow
Return

Cu-EGaIn enabled stretchable e-skin for interactive electronics and CT assistant localization

delete2020-01-01
delete66
PRE
AI
R
Rui Guo
B
Bixiao Cui
赵晓静 (Xiaojing Zhao)
M
Minghui Duan
孙旭阳 cover
孙旭阳 (Xuyang Sun)
R
Ruiqi Zhao
L
Lei Sheng
刘景 (Jing Liu) *
卢杰 (Jie Lu) *
DOI:10.1039/c9mh02066gdelete
deleteOriginal
deleteOriginal request for help
deleteShare
deleteSave
Abstract

Abstract

En 中文
Electronic skin (e-skin) is attracting huge attention due to its promising applications in diverse fields, including biomimetic machines, artificial intelligence and smart robotics. However, most e-skin circuits involve complicated fabrication processes and high costs. Here, a simple, fast fabrication method for highly conductive (6 x 10(6)S m(-1)) and stretchable (above 100%) e-skin based on the adhesion selectivity of a semi-liquid metal (Cu-EGaIn) on laser printed toner and a polymethacrylate (PMA) coating is developed. The stretchable e-skin circuits are shown to transfer to human skin and 3D substrates as wearable electronics for a variety of applications, such as temperature monitoring, interactive devices, and flexible displays. Different from other liquid metal patterning techniques that require expensive equipment or rigid metal traces such as silver nanoparticles, this approach can be used to directly print Cu-EGaIn on a stretchable substrate with a commercial laser printer in seconds. Further, by virtue of the advantage of the high radiological imaging capability of Cu-EGaIn, the e-skin is patterned as a computed tomography (CT) assistant localization marker, which is demonstrated to be very helpful for doctors and surgical robots to efficiently localize a biopsy, which is a core issue in clinics. The present study holds promise for future health care, surgical guidance and personalized entertainment.
Keywords:
PRINTABLE ELASTIC CONDUCTORS
25TH ANNIVERSARY ARTICLE
LIQUID-METALS
FAST FABRICATION
SENSOR
SOFT
PRESSURE
AI Summary

AI Summary

Key information extracted from the uploaded paper, including a brief overview, abstract, background, key highlights, visual analysis, and future outlook.

Journal

Materials Horizons cover
Materials Horizons
IF:
10.7
Papers:
3.6K
Citations:
2.4W

Organization

C
Capital Medical University
Scholars:
5.3W
Papers: 3.3W
Citations: 3.2W
T
tsinghua university
Scholars:
11.8W
Papers: 10.0W
Citations: 137
C
chinese academy of sciences
Scholars:
56.3W
Papers: 44.8W
Citations: 704
researcher View more organizations