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Cure and degradation kinetics of curcumin-derived epoxy thermosets: effect of disulfide containing curing agents on thermal stability and adhesion
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DOI：10.1016/j.tca.2026.180388.png)
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Abstract
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• Cure kinetics of DGEC epoxy analyzed using Kissinger and Ozawa methods. • Aromatic curing agent increases activation energy and network rigidity. • TGA reveals enhanced thermal stability and char yield in aromatic systems. • TTS applied to isothermal TGA to construct master degradation curves. • Degradation kinetics follow Arrhenius behavior with composition dependence.
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