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Defect detection in metals using electronic speckle pattern interferometry
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DOI：10.1016/j.solmat.2004.03.009.png)
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Abstract
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We use the out-of-plane electronic speckle pattern interferometry (ESPI) technique to observe cracks and fracture defects on 6061 aluminum plates under thermal stress. The geometrical shape of the ESPI pattern confirmed the existence of defects. We were able to differentiate between cracks and fracture defects using a non-contact and non-destructive technique. (c) 2004 Elsevier B.V. All rights reserved.
Keywords:
material defect detection
electronic interferometry
material fatigue
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