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Depoisoning Catalysts by Atomic Layer Etching
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DOI：10.1002/cctc.202500895.png)
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Abstract
En 中文
To improve the sustainability of transition metal catalysts, which suffer from deactivation through poisoning when exposed to sulfur-containing compounds, atomic layer etch (ALE)—a technique studied predominantly by the microelectronics and semiconductor communities—is explored as a method of regenerating metal catalysts. In this work, the CO2 reduction reaction (CO2RR) through electrolysis over a copper (Cu) catalyst is used as a model system to evaluate the efficacy of the ALE process in de-poisoning the catalyst studied. Copper surfaces that were poisoned with 1-dodecanethiol showed reduced faradaic efficiencies for CO2RR. Treating the poisoned copper surfaces with an oxygen plasma, the first step of a copper ALE process, restored most of the CO2RR catalytic performance. Completing a full ALE cycle using both oxygen plasma and formic acid vapor resulted in further improved CO2RR faradaic efficiencies, likely due to the increased surface roughness.
Keywords:
Atomic layer etching
Catalyst poisoning
Catalyst regeneration
CO2 reduction
Electrocatalysis
Journal
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