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Design and performance study of a combined titanium-sublimation and ion pump
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DOI：10.1016/j.vacuum.2026.115584.png)
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Abstract
En 中文
Sputter ion pump (SIP) and titanium sublimation pump (TSP) are both common equipment for achieving high vacuum. However, traditional ion pumps can interfere with the normal operation of some vacuum electronic devices due to the presence of intense magnetic fields and high voltages. While titanium sublimation pumps have poor pumping capacity for inert gases, leading to certain gas residuals. Although simply connecting the two within the same chamber can achieve a higher vacuum level, it still cannot prevent their working mechanisms from affecting the normal operation of the electronic devices inside the vacuum chamber. In this work, we design a low-voltage, non-magnetic, combined titanium-sublimation and ion pump, which combines the high pumping speed of TSP and the inert gases removal capability of ion pump. The electron and ion trajectories are simulated to obtain an optimal pump structure and electric potential configuration. Furthermore, the impact of various parameters on the performance of titanium sublimation source and ion source is experimentally demonstrated. Experimental results confirm the effective pumping capacity of titanium sublimation source and the gas ionization ability of ion source. Finally, the pumping performance of the designed ion pump was verified based on the orifice conductance method.
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