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Device-level vacuum packaged uncooled microbolometer on a polyimide substrate
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DOI：10.1016/j.infrared.2016.09.011.png)
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Abstract
En 中文
Uncooled infrared detectors (IR) on a polyimide substrate have been demonstrated where amorphous silicon (a-Si) was used as the thermometer material. New concepts in uncooled microbolometers were implemented during the design and fabrication, such as the integration of a germanium long-pass optical filter with the device-level vacuum package and a double layer absorber structure. Polyimide was used for this preliminary work towards vacuum-packaged flexible microbolometers. The detectors were fabricated utilizing a carrier wafer and low adhesion strength release layer to hold the flexible polyimide substrate during fabrication in order to increase the release yield. The IR detectors showed a maximum detectivity of 4.54 x 10(6) cm Hz(1/2)/W at a 4 Hz chopper frequency and a minimum noise equivalent power (NEP) of 7.72 x 10(-10) W/Hz(1/2) at a biasing power of 5.71 pW measured over the infrared wavelength range of 8-14 mu m for a 35 mu m x 35 mu m detector. These values are comparable to other flexible microbolometers with device-level vacuum packaging which are found in literature. (C) 2016 Elsevier B.V. All rights reserved.
Keywords:
Bolometer
Flexible substrate
Double layer absorber
Optical filter
Infrared radiation
MEMS sensors
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