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EFFECT OF ELECTRIC PULSING ON THE STRUCTURE, TEXTURE AND HARDNESS OF CRYOROLLED FINE-GRAIN COPPER
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DOI：10.22190/FUME220127030M.png)
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Abstract
En 中文
A synergy effect of cryorolling and high-dense electric pulsing on the structure, texture and hardness of fine-grain Cu is analyzed. More than twice Cu strengthening under rolling with 90% reduction at -196 degrees C was caused by strong rolling texture and work-hardened nanostructure with similar to 300 nm crystallites and similar to 30% fraction of high-angle boundaries. Further single pulsing with current intensity K-j = 3.5x10(4) A(2)s/mm(4) resulted in a static recovery and slight Cu softening due to the formation of a more equilibrium structure with lower dislocation density and lattice microstrain. Increasing K-j to 3.8x10(4) A(2)s/mm(4) led to a sharp drop in the Cu hardness owing to continuous recrystallization and texture randomization. At K-j near 5.0x10(4) A(2)s/mm(4) homogeneous ultrafine-grain structure with 1 mu m defect free equiaxed grains and about 30% of twin boundaries is formed. Normal grain growth to 3 mu m and gradual decrease of the Cu hardness were taking place at higher pulsing energies, up to 8.1x10(4) A(2)s/mm(4).
Keywords:
Copper
Cryorolling
Electric Pulsing
Structure
Texture
Hardness
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