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Effect of Honeycomb Architectures on EMI Shielding (EMI SE) and Reflection Loss (RL) in Multi-Material 3D-Printed Polylactic Acid (PLA)
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DOI：10.1002/pen.70613.png)
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Abstract
En 中文
Fused filament fabrication (FFF) enables multimaterial architectures with functional properties, providing a scalable route to customizable electromagnetic interference (EMI) shielding with complex geometries. Commercial conductive PLA and neat PLA were printed as plate-based structures, including dense plates and honeycomb-core sandwich architectures with 10% and 20% infill. Filaments were characterized by FTIR, TGA, and DMA, while printed parts were analyzed by SEM and evaluated in the X (8.2–12.4 GHz) and Ku (12.4–18 GHz) bands. Dense conductive PLA parts exhibited low microwave absorption (RL ≈ −2.5 dB) due to impedance mismatch and dominant surface reflection, whereas introducing insulating PLA layers improved impedance matching and increased high-frequency absorption. For honeycomb cores, 10% infill enhanced absorption through lower effective permittivity and increased multiple internal reflections, while 20% infill increased effective density/permittivity and reduced absorption. EMI shielding effectiveness (EMI SE) depended primarily on conductive-skin thickness, conductive volume fraction, and core architecture, with conductive skins on both outer surfaces consistently outperforming insulating-skin designs. Across all architectures, shielding was absorption-dominated (SEA ≫ SER). The best balance between performance and material efficiency was achieved with 3 mm conductive skins and a 2 mm insulating honeycomb core at 10% infill, delivering ~23 dB EMI SE.
Keywords:
electromagnetic shielding
fused filament fabrication
honeycomb
multimaterial
polylactic acid
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