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Effect of substrate preheating and resistance-heating energy on wire melting behavior and metallurgical bonding in resistance-heated wire additive manufacturing
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DOI：10.1016/j.cirpj.2026.05.013.png)
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Abstract
En 中文
Resistance-heated wire additive manufacturing (RWAM) enables metal deposition through Joule heating and is considered a promising technique for in-orbit manufacturing. However, insufficient metallurgical bonding caused by large interfacial temperature gradients remains a critical challenge. In this study, the coupled effects of substrate preheating and resistance-heating energy on wire melting behavior and interfacial bonding were systematically investigated. A RWAM system with integrated substrate preheating and synchronized multi-signal acquisition was developed to capture thermal, electrical, and visual data. Characteristic melting lengths and dynamic resistance were introduced to quantify temperature field evolution and melting dynamics. Results show that substrate preheating significantly accelerates wire melting, reduces the solid-phase heat conduction region, and promotes downward migration of the temperature field, thereby improving interfacial thermal coupling. Increasing current enhances the melting rate but intensifies thermal gradients, whereas pulsed current stabilizes the process by suppressing transient fluctuations and facilitating heat redistribution. Microstructural characterization reveals that appropriate parameter combinations promote grain refinement, suppress impurity segregation, and ensure compositional homogeneity at the interface. For Q235 steel, sound metallurgical bonding is achieved when the substrate temperature exceeds ∼800 °C or under high pulsed-current conditions. These findings provide insights into the process–temperature–interface relationship and offer guidance for stable and efficient RWAM in space environments.
Keywords:
Resistance-heated wire additive manufacturing
substrate preheating
wire melting behavior
metallurgical bonding
thermal gradient
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5.4
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283
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