.png){kind=icon}
.png){kind=icon}
Return
Elastic strain engineering of lattice thermal conductivity of silicon: an ab-initio study
.png){kind=icon}
PRE
AI
W
Z
L
J
M
DOI：10.1016/j.eml.2026.102469.png)
.png){kind=icon}
Original request for help.png){kind=icon}
Share.png){kind=icon}
Save
Abstract
En 中文
• The thermal conductivity response of silicon is dependent on the strain state, with hydrostatic, biaxial, and uniaxial loading each producing a unique behavior • Uniaxial and biaxial strains can induce highly anisotropic thermal conductivity in silicon, with relative variations up to 13.4% and 58.5%, respectively • Close agreement between ab initio calculations and experimental data confirms that compressive elastic strain systematically reduces silicon's thermal conductivity • Through elastic strain engineering, silicon’ thermal conductivity can be tuned from −90% to +2% relative to its zero‑strain value, by modulating phonon anharmonicity
Keywords:
elastic strain engineering
lattice thermal conductivity
silicon
phonon anharmonicity
ab initio calculations
Journal
IF:
4.5
Papers:
1.5K
Citations:
6.7K
Organization
Cited Papers