.png){kind=icon}
.png){kind=icon}
Return
Embedding Components During Laser Sintering
.png){kind=icon}
OA
AI
DOI：10.1016/j.addlet.2022.100055.png)
.png){kind=icon}
.png){kind=icon}
Share.png){kind=icon}
Save
Abstract
En 中文
We propose an approach for embedding electronic components during a Selective Laser Sintering (SLS) process. Common SLS processes are incompatible with component embedding because generating voids in the parts developed using this production method is logistically challenging. Here, we use an inverted laser sintering (ILS) process that sidesteps the need for a powder bed, and can therefore trivially generate voids in printed components. We demonstrate this method by embedding an LED inside an SLS part cavity, and then resuming the printing process. The LED is then externally activated, confirming its functionality after several layers are added. This ability could help transform SLS from fabricating passive parts to active systems.
AI Summary
Key information extracted from the uploaded paper, including a brief overview, abstract, background, key highlights, visual analysis, and future outlook.
Journal
IF:
4.7
Papers:
393
Citations:
895