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Enhanced thermal management for vertically immersed high-power chips via micro-pillar structured surfaces
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韩
DOI：10.1016/j.ijheatmasstransfer.2026.129401.png)
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Abstract
En 中文
• Seventeen micro-pillar surfaces were tested for vertical immersion cooling. • Gradient arrays passively mitigated vapor accumulation on vertical surfaces. • Slender pillars reduced bubble departure diameter and bubble trapping. • Favorable length and spacing gradients enhanced boiling heat transfer performance compared with uniform arrays. • A critical heat flux correlation described the tested surfaces with deviations within ± 5%.
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