Exploiting the pilling-bedworth effect: a two-step oxidation-reduction bonding for pressureless Cu sintering

X. Gao

doi:10.1016/j.apsusc.2026.168067

Exploiting the pilling-bedworth effect: a two-step oxidation-reduction bonding for pressureless Cu sintering

2026-08-08

0

PRE

AI

X

X. Gao

R

Renli Fu *

P

P.Y. Zeng

Y

Y.T. Xue

J

J.J. Mu

DOI：10.1016/j.apsusc.2026.168067

Original

Original request for help

Save

Abstract

En 中文

• An oxidation–reduction bonding strategy is proposed for pressureless Cu nanoparticle sintering. • The Pilling–Bedworth effect is exploited to induce self-densification of Cu nanoparticle joints. • Controlled pre-oxidation generates internal compressive stress and reduces initial porosity. • In-situ reduction of Cu oxides produces highly active nascent Cu atoms for neck growth. • The optimized joint achieves a shear strength of 23.94 MPa, 117.2% higher than direct reduction.

Keywords:

Cu nanoparticles

Pressureless sintering

Oxidation–reduction sintering strategy

Pilling-Bedworth effect

Exploiting the pilling-bedworth effect: a two-step oxidation-reduction bonding for pressureless Cu sintering

Abstract

Journal

Organization

Cited Papers

Citing Papers