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Exploiting three-dimensional (3D) memory stacking to improve image data access efficiency for motion estimation accelerators

delete2010-06-01
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PRE
AI
Y
Yiran Li *
刘
刘洋 (Yang Liu)
T
Tong Zhang
DOI:10.1016/j.image.2010.04.002delete
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Abstract

Abstract

En 中文
Enabled by the emerging three-dimensional (3D) integration technologies, 3D integrated computing platforms that stack high-density DRAM die(s) with a logic circuit die appear to be attractive for memory-hungry applications such as multimedia signal processing. This paper considers the design of motion estimation accelerator under a 3D logic-DRAM integrated heterogeneous multi-core system framework. In this work, we develop one specific DRAM organization and image frame storage strategy geared to motion estimation. This design strategy can seamlessly support various motion estimation algorithms and variable block size with high energy efficiency. With a DRAM performance modeling/estimation tool and ASIC design at 65 nm, we demonstrate the energy efficiency of such 3D integrated motion estimation accelerators with a case study on HDTV multi-frame motion estimation. (C) 2010 Elsevier B.V. All rights reserved.
Keywords:
Motion estimation (ME)
3D memory stacking
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Journal

S
Signal Processing and Image Communication
IF:
2.7
Papers:
2.8K
Citations:
4.2K

Organization

R
rensselaer polytechnic institute
Scholars:
7.0K
Papers: 6.5K
Citations: 6
J
juniper networks
Scholars:
46
Papers: 39
Citations: 0
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