.png){kind=icon}
.png){kind=icon}
Return
Fully SMT-compatible optical-I/O package with microlens array interface
.png){kind=icon}
PRE
AI
DOI：10.1109/JLT.2003.808611.png)
.png){kind=icon}
Original request for help.png){kind=icon}
Share.png){kind=icon}
Save
Abstract
En 中文
A new optoelectronic package for interchip optical interconnections is presented. To make cost-effective IC-packaging and printed circuit board (PCB) assembly, we strongly emphasize the need for full compatibility with surface-mount technology (SMT). Based on the OptoBump interface, which couples the package and PCB by means of an array of wide, collimated beams, we developed two prototype packages: a transmitter package that contains a vertical-cavity surface-emitting laser (VCSEL) array and a driver-IC, and a receiver package that contains a photodiode (PD) array and a receiver-IC. A microlens array is integrated with each package to counteract misalignments that occur in the SMT process. All three output signals, which are E/O (O/E)-converted in the each package, exhibit clear eye diagrams at 1.25 Gb/s after the packages are surface-mounted on a PCB. The influence of polymer encapsulation on a VCSEL and an evaluation of the optical interface provided by the three optical beams on a 500-mum center-to-center spacing are also discussed.
Keywords:
Microlens
optical interconnections
packaging surface-mount technology
vertical-cavity surface-emitting laser
Journal
IF:
4.8
Papers:
1.7W
Citations:
3.8W
Organization
No organization information available