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High Performance Polyimide Composites with 3D Boron Nitride Networks
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DOI：10.1021/acsaelm.5c02216.png)
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Abstract
En 中文
Efficient thermal management is a critical challenge for high-power-density electronics, particularly in the aerospace sector. This work presents a hierarchical composite film with exceptional thermal conductivity and robust electrical insulation, fabricated by hot-pressing electrospun boron nitride-polyimide (BN/PI) papers with a BN-rich bismaleimide (BMI) adhesive. This unique multilayer architecture establishes a three-dimensional (3D) BN network, where the BN-enriched adhesive layers serve as thermal bridges to minimize interfacial thermal resistance. Consequently, the composite film achieves a high through-plane thermal conductivity of 7.62 W/(mK), a 38.1-fold enhancement compared to pure PI, while maintaining an excellent breakdown strength of 204.7 kV/mm and low dielectric loss (<0.02). The enhanced electrical insulation is attributed to the strong Maxwell-Wagner-Sillars (MWS) interfacial polarization at the heterogeneous PI/BN-BMI interfaces, which homogenizes the electric field and suppresses charge transport. The scalable design strategy proposed in this study achieves a synergistic improvement in thermal conductivity and insulation and offers a promising material solution for advanced thermal management in next-generation aerospace systems.
Keywords:
polyimide
boron nitride
composite film
three-dimensional thermal network
electrical insulation
Journal
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4.7
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5.0K
Citations:
1.4W
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