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High-precision moire alignment method using centrosymmetric grating for 3D interlayer interconnect
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DOI：10.1016/j.optlaseng.2023.107815.png)
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Abstract
En 中文
The fabrication of integrated circuits in the future will rely heavily on high-precision three-dimensional interlayer interconnect alignment technology. In this study, we explore a controllable and clear-cut alignment method based on moire'centrosymmetric grating marks that can achieve fine alignment in the X-Y-theta direction simultaneously with only a single alignment mark without additional coarse alignment mark. Compared with the traditional peak-intensity-based detection method, circumferential alignment of the order of 10(-4 )deg and radial alignment of less than 10 nm can be achieved, and its fine alignment accuracy is improved by nearly two orders of magnitude by using the proposed local moire' phase alignment method. With further optimization of the parameters, sub-nanometer alignment is expected to be achieved. Moreover, our measurement system is simpler and more stable. Both simulation and experimental results verify the feasibility of the proposed method. The uncertainty analysis of the results is also reported.
Keywords:
Interlayer interconnect alignment
Moire' fringe technology
Centrosymmetric grating marks
Misalignment measurement
Alignment accuracy
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