.png){kind=icon}
.png){kind=icon}
Return
Improving weld formation in ultrasonic Cu–Cu joining via tailoring the twin structure of interlayers
.png){kind=icon}
PRE
AI
X
G
L
C
J
Q
DOI：10.1177/13621718261458105.png)
.png){kind=icon}
Original request for help.png){kind=icon}
Share.png){kind=icon}
Save
Abstract
En 中文
<jats:p>In the ultrasonic welding (UW) process, achieving reliable bonding under low ultrasonic energy input is crucial for minimising surface damage and improving long-term service stability of joints. In this research, three Cu interlayers with horizontal (H–TBs), inclined (I–TBs) and vertical twin boundaries (V–TBs) were designed to accelerate weld formation during UW. At a welding time of 0.3 s, lap shear tests indicated that the I–TBs joint exhibited 38.6% and 54.9% higher strength than the H–TBs and V–TBs joints, respectively. The moderate microhardness, elevated coefficient of friction and activation of soft-mode dislocation motion in the I–TBs joint generated localised plastic instability, accelerated the flattening process and improved metallurgical bonding under the low energy inputs.</jats:p>
Journal
S
IF:
3.7
Papers:
2.3K
Citations:
4.9K
Organization
Cited Papers