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In-situ embedded–anchored construction of rGO/Cu interfaces for synergistic enhancement of the properties of cold-pressed and sintered Cu matrix composites
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DOI：10.1016/j.jmrt.2026.06.158.png)
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Abstract
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Graphene/Cu composites have attracted considerable attention because they combine the excellent properties of both Cu and graphene. However, graphene agglomeration, weak interfacial bonding, and insufficient particle contact often lead to poor densification and limited overall performance of the composites. In this work, Cu matrix composites with different GO contents were fabricated by cold pressing and sintering using rGO/Cu composite powders prepared through molecular-level mixing. During the reduction process, Cu ions were in-situ transformed into nano-Cu particles embedded within the rGO interlayers or anchored onto the rGO surface. The embedded nano-Cu particles enlarged the graphene interlayer spacing, suppressed agglomeration, and strengthened the rGO/Cu interface, while the anchored nano-Cu particles promoted Cu–Cu metallurgical bonding and improved densification during sintering. The results show that CCu1 exhibited the optimum electrical conductivity of 95.10% IACS and a thermal conductivity of 327 W·m−1·K−1, corresponding to increases of 21.4% and 14.7%, respectively, compared with the pure Cu counterpart prepared under identical processing conditions. These improvements arise from the combined effects of enhanced densification and interfacial regulation induced by the embedded–anchored rGO/Cu architecture. The highest compressive strength of 280.2 MPa was achieved at 0.3 wt% GO, while the average friction coefficient decreased from 0.111 to 0.055. These results demonstrate that the interfacial structure between Cu particles can be effectively regulated through the design of rGO/Cu composite powders under cold pressing–sintering conditions. Without relying on SPS or other high-energy sintering techniques, the densification behavior, electrical and thermal transport, mechanical strength, and tribological performance of Cu matrix composites can be simultaneously improved, thereby providing a new strategy for the facile and scalable fabrication of high-performance Cu matrix composites.
Keywords:
Molecular-level mixing
Embedded-anchored interface
Cold pressing–sintering
Electrical and thermal conductivity
Tribological properties
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