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Influence of stacking fault energy and slip planarity on dislocation/grain boundary interactions in FCC metals
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DOI：10.1016/j.ijplas.2026.104778.png)
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Abstract
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• The magnitude of the stress concentration associated with dislocation/grain boundary interactions corresponds to the slip compatibility across the boundary in stainless steel and Ni, but not in Al. • Extensive cross slip in Al leads to strain homogenization and the absence of dislocation pileup behavior. • Grain boundaries in stainless steel harden under tensile loads at a faster rate than in Ni or Al.
Keywords:
grain boundary
dislocation
EBSD
stacking fault energy
stress fields
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