Integrated computational investigation of interfacial bonding and stress mitigation mechanisms in C/C-SiC/410B stainless steel brazed joints

2026-08-05

PRE

Haitao Zhu

Wenlong Zhou

Xingyi Li

Yanyu Song *

Hyoung Seop Kim

Duo Liu

Shengpeng Hu

Xiaoguo Song

DOI：10.1016/j.compositesb.2026.114056

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• Reliable bonding of C/C-SiC to 410B SS was achieved using a CuMn filler. • Potential gradient drives reactions and d-p hybridization aids bonding. • Gradient interface mitigated stress to yield peak strength at 980 °C.

Integrated computational investigation of interfacial bonding and stress mitigation mechanisms in C/C-SiC/410B stainless steel brazed joints

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