Interfacial microstructure and dynamic recrystallization in metallurgically bonded Al/Mg laminate fabricated by vacuum hot compression bonding

2026-04-17

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Lihua Qian

J.E. Tang *

Liang Chen *

Kaiqiang Shen

Xuemei Sun

Cunsheng Zhang

DOI：10.1016/j.jallcom.2026.188106

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Abstract

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• Al/Mg laminate was fabricated via vacuum hot compression bonding. • Higher strain rate altered the growth kinetics of IMCs. • The dominant dynamic softening mechanism in the Mg layer changed by increasing the strain rate or temperature. • The variant selection of {10−12} tensile twins and the corresponding effect on the < 10–10 > texture were clarified.

Keywords:

Al/Mg laminate

interfacial microstructure

dynamic recrystallization

vacuum hot compression bonding

strain rate effects

Interfacial microstructure and dynamic recrystallization in metallurgically bonded Al/Mg laminate fabricated by vacuum hot compression bonding

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