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Introducing Dynamic Bonds in Light-based 3D Printing

delete2023-04-23
delete24
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OA
AI
G
Guangda Zhu
H
Hannes A. Houck
C
Christoph A. Spiegel
C
Christine Selhuber‐Unkel
Y
Yi Hou *
E
Eva Blasco *
DOI:10.1002/adfm.202300456delete
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Abstract

Abstract

En 中文
Light-based 3D printing has received significant attention due to several advantages including high printing speed and resolution. Along with the development of new technologies, material design is key for the next generation of light-based 3D printing. Conventional printable polymeric materials, also known as photopolymers or photoresins, often lead to thermosets-polymer networks cross-linked by permanent covalent bonds which bring limited adaptability and restricted reprocessability. Dynamic bonds that can reversibly break and reform enable network rearrangement, thereby offering unprecedented properties to the materials such as adaptability, self-healing, and recycling capabilities. Hence, introducing dynamic bonds into materials for light-based 3D printing is a promising strategy to further expand and meet the diverse application scenarios of 3D printed multi-functional materials and moreover meet more demanding sustainable and nature-inspired design considerations (e.g., adaptability and self-healing). Herein, an overview of recent advances in dynamic photopolymers for light-based 3D printing, aiming to bridge these two promising research fields is presented. Importantly, the current challenges are also analyzed and perspectives for further developing dynamic photopolymers for light-based 3D printing and their potential applications are provided.
Keywords:
3D printing
dynamic bonds
photopolymerization
recycling
self-healing
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Journal

Advanced Functional Materials cover
Advanced Functional Materials
IF:
19
Papers:
3.4W
Citations:
32.1W

Organization

R
Ruprecht Karls University Heidelberg
Scholars:
5.6W
Papers: 4.3W
Citations: 66
C
City University of Hong Kong
Scholars:
2.3W
Papers: 3.0W
Citations: 6.1W
U
University of Warwick
Scholars:
2.2W
Papers: 2.2W
Citations: 85
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