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Laser Cleaning for Mitigating Non-Wetting in CCGA Solder Joints While Preserving Joint Reliability
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DOI：10.1007/s11664-026-12820-2.png)
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Abstract
En 中文
During long-term storage, the pad plating of ceramic column grid array (CCGA) devices is susceptible to oxidation, leading to the formation of refractory oxides that are difficult to remove. This compromises the wettability of solder joints and undermines their long-term service reliability. To address this issue, this study introduces an innovative laser cleaning process as a pretreatment step for CCGA devices. The influence of laser power on cleaning efficacy was systematically evaluated. Results show that at an optimized power of 9 W, oxide content on the pad surface is markedly reduced, effectively alleviating non-wetting defects. Importantly, the laser treatment causes no significant alteration to the ceramic substrate or plating thickness, demonstrating its selectivity in removing oxides without damaging the underlying material. Mechanical testing confirms that the shear force of the resulting solder joints remains within the specified requirements. Furthermore, thermal cycling tests (-65 degrees C to 150 degrees C) were conducted to investigate interfacial evolution. A uniform and continuous intermetallic compound (IMC) layer was observed at the solder joint interface, with its total thickness (delta) following a power-law relationship with aging time (t), i.e., delta proportional to t(1/2). This behavior indicates that the interfacial growth is governed by a diffusion-controlled mechanism, reflecting stable and predictable evolution. In conclusion, laser cleaning offers an effective solution to non-wetting issues in CCGA assemblies and contributes significantly to ensuring their reliability in long-term service.
Keywords:
Ceramic column grid array (CCGA)
non-wetting
laser cleaning
reliability
Journal
J
IF:
2.5
Papers:
485
Citations:
0
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