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Material Property Simulation for Advanced Packaging
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DOI：10.1007/s11664-025-12636-6.png)
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Abstract
En 中文
This paper demonstrates the potential of material simulation methodologies in advanced packaging. Various material simulation methodologies, such as molecular dynamics (MD), quantum mechanics (QM), and machine learning (ML), are utilized to calculate material properties of a polyimide material and a photo imageable dielectric (PID) material. Key properties, such as T-g, coefficient of thermal expansion (CTE), modulus, dielectric properties, refractive index, as well as volume shrinkage after curing, are simulated and compared with actual experimental data. These methodologies can also be applied to predict the properties of other organic packaging materials, playing a crucial role in developing accurate process, yield, and reliability simulations for advanced packaging.
Keywords:
MD
QM
ML
polymer
polyimide
PID
T-g
modulus
dielectric property
volume shrinkage
advanced packaging
Journal
J
IF:
2.5
Papers:
579
Citations:
0
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