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Materials for thermal conduction

delete2001-11-01
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D.D.L. Chung
DOI:10.1016/S1359-4311(01)00042-4delete
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Abstract

Abstract

En 中文
Materials for thermal conduction are reviewed. They include materials exhibiting high thermal conductivity (such as metals, carbons.. ceramics and composites), and thermal interface materials (such as polymer-based and silicate-based pastes and solder). (C) 2001 Elsevier Science Ltd. All rights reserved.
Keywords:
thermal conduction
thermal conductivity
thermal paste
thermal contact
composite
interface
AI Summary

AI Summary

Key information extracted from the uploaded paper, including a brief overview, abstract, background, key highlights, visual analysis, and future outlook.

Journal

Applied Thermal Engineering cover
Applied Thermal Engineering
IF:
6.9
Papers:
2.8W
Citations:
10.6W

Organization

No organization information available
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