Mechanisms of isotropic removal in polycrystalline diamond during chemical mechanical polishing: Roles of polishing pads and abrasives in achieving atomic-scale surfaces

2026-08-05

PRE

Song Yuan

Chi Fai Cheung *

Lai Ting Ho

Chunjin Wang

Yuanliu CHEN *

DOI：10.1016/j.jmatprotec.2026.119457

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Abstract

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• The impact of polishing pads and abrasives on PCD surface morphology was elucidated. • The anisotropic removal of PCD was suppressed, with reduced height variations between adjacent grains. • An atomic-level surface with Ra 0.091 nm within individual grains are achieved. • The almost damage-free subsurface of PCD was obtained. • The combined effects of mechanical and chemical actions were highlighted.

Keywords:

Polycrystalline diamond

Chemical mechanical polishing

Atomic-scale surfaces

Subsurface damage

Anisotropic removal

Ultra-precision machining

Mechanisms of isotropic removal in polycrystalline diamond during chemical mechanical polishing: Roles of polishing pads and abrasives in achieving atomic-scale surfaces

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