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Microstructure evolution, interfacial bonding and surface energy mechanism of Ti2AlNb/Ti60 brazed joint with Cu/Ni-free Ti-Co-Fe-Sn amorphous filler
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DOI：10.1016/j.intermet.2026.109400.png)
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Abstract
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• A novel Cu/Ni-free Ti-25Co-10Fe-8Sn amorphous filler with low surface energy (0.0570 eV/Å2) was designed. • The joint features an optimized “tough α-Ti matrix + discrete Ti3Sn/Ti2(Co, Fe)” architecture. • Semi-coherent α-Ti/Ti3Sn (21.1% mismatch) has stronger bonding via Ti-d/Sn-d hybridization and 0.3248 eV/Å2 separation work. • Room-temperature shear strength: 247.7 MPa (∼46% higher than conventional joints), improved toughness. • Multiscale experiments + first-principles clarify microstructure-interface-property correlation for titanium brazing.
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