.png){kind=icon}
.png){kind=icon}
Return
Modeling void evolution in bimetallic solid-state bonding under large deformation
.png){kind=icon}
PRE
AI
DOI：10.1016/j.ijmecsci.2026.111683.png)
.png){kind=icon}
Original request for help.png){kind=icon}
Share.png){kind=icon}
Save
Abstract
En 中文
• Void evolution model considering complex stress and diffusion is established. • Plastic deformation reduces the void neck area and accelerates element diffusion. • Interfacial bonded fraction equation is proposed for bimetallic solid-state bonding. • Rigid collapse and power-law creep mechanism promote void shrinkage process.
Keywords:
Void evolution
Bimetallic solid-state bonding
Plastic deformation
Diffusion
Creep mechanism
Journal
IF:
9.4
Papers:
1.0W
Citations:
4.5W