.png){kind=icon}
.png){kind=icon}
Return
Multi-channel high-speed flip-chip packaging platform for thin-film lithium niobate photonic circuits
.png){kind=icon}
OA
AI
Z
X
Y
Y
Z
H
Y
Z
Z
Y
M
K
Y
C
DOI：10.1093/nsr/nwag480.png)
.png){kind=icon}
Original request for help.png){kind=icon}
Share.png){kind=icon}
Save
Abstract
En 中文
To address the urgent need for multi-channel high-speed electrical interfacing of thin-film lithium niobate (TFLN) photonic circuits, we realize a flip-chip packaging platform capable of simultaneously delivering 13 high-speed and 32 low-speed electronic signals to a centimeter-sized TFLN chip. The platform exhibits low flip-chip bonding loss and low inter-channel crosstalk over a broad bandwidth up to 50 GHz. Leveraging this packaging platform, we demonstrate high-speed electrical interfacing with two proof-of-concept TFLN photonic circuits, namely a 2 × 8 optical switch and an electro-optic comb-based transmitter. The switch achieves arbitrary 8-channel routing with ~3 dB insertion loss, < -20 dB crosstalk, and an equipment-limited switching time of ≤ 34 ps. The transmitter circuit includes a 50 GHz electro-optic comb generator with 2.8-dB flatness, a tunable microring to arbitrarily filter one comb line, and a modulator for data transmission at 20 Gbit/s. The packaging platform could significantly advance large-scale TFLN circuits in optical communications, microwave photonics, and photonic computing.
Journal
IF:
17.1
Papers:
3.6K
Citations:
2.0W
Organization
Cited Papers