Multiple-Input Multiple-Output Enabled Large Bandwidth Density On-Chip Optical Interconnect

doi:10.1109/JLT.2016.2527721

Multiple-Input Multiple-Output Enabled Large Bandwidth Density On-Chip Optical Interconnect

2016-06-15

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DOI：10.1109/JLT.2016.2527721

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We propose to apply the multiple-input multiple-output ( MIMO) from wireless communication to high density on-chip optical interconnect. MIMO makes it possible to reduce the waveguide pitch to subwavelength range and uses the crosstalk to improve system performance. The proposed NxN on-chip MIMO system consists of transmitter, high-density waveguides, homodyne coherent receivers, and electrical signal processing components. As an example, a 10 x 10 MIMO system with waveguide spacing of 250 nm is simulated. The possibility of data transmission at 10 Gb/s/channel fromhigh-densitywaveguide array is numerically investigated. The minimum input optical power for the BER of 10(-12) can reach -18.1 dBm. The BER is better than 10(-12) when there is a phase shift of 73.5 degrees. Compared to the conventional parallel waveguides with 2-mu m pitch, the bandwidth density can be enhanced from 5 to 13.33 Gbit/mu m/s at 10 Gb/s by using the MIMO techniques.

Keywords:

Optical interconnections

optical waveguides

silicon photonics

Multiple-Input Multiple-Output Enabled Large Bandwidth Density On-Chip Optical Interconnect

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