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Nanocutting mechanism of multi-layered metallic nanowires
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DOI：10.1016/j.ijmachtools.2026.104376.png)
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Abstract
En 中文
• Elucidate anisotropic constraint and stress reconstruction mechanisms, revealing loading-path-dictated morphology evolution. • Strain localization emerges as the dominant failure mechanism, clarifying the plasticity-to-fracture transition. • Reveal the temperature-dominated stress–defect synergistic diffusion and asymmetric interfacial diffusion mechanism. • Establish a coordinated quality and structural integrity control strategy for deterministic manufacturing of multi-layer devices.
Keywords:
anisotropic constraint
stress reconstruction
strain localization
temperature-dominated diffusion
multi-layered metallic nanowires
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