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Nanoparticle-Enabled Selective Electrodeposition

delete2011-05-03
delete24
PRE
AI
H
Hsien‐Ping Feng
T
Trilochan Paudel
B
Bo Yu
陈硕 (Shuo Chen)
Z
Zhi Ren *
陈刚 cover
陈刚 (Gang Chen)
DOI:10.1002/adma.201004656delete
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Abstract

Abstract

En 中文
Electrodeposition of a material onto a conducting substrate with strong adhesion and exceptional uniformity through the use of platinum nanoparticles as the seed layer is reported. The use of platinum nanoparticles also creates an optimum voltage range to selectively electroplate various metals on substrate into areas seeded with the nanoparticles. [GRAPHICS] .
Keywords:
FABRICATION
NUCLEATION
ARRAYS
GLASS
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Journal

Advanced Materials cover
Advanced Materials
IF:
26.8
Papers:
3.4W
Citations:
46.0W

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B
Boston College
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Citations: 8.8K