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Novel high-resolution wireless temperature sensor based on sandwich complementary split-ring resonator substrate-integrated waveguide structure
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DOI：10.1088/1361-6501/ae0818.png)
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Abstract
En 中文
This paper presents a novel high-resolution wireless temperature sensor based on microwave backscattering principles. The proposed design features a sandwich substrate-integrated waveguide (SIW) structure that incorporates a complementary split-ring resonator etched on the upper conductive layer of a printed circuit board (PCB) stack. This sandwich configuration integrates a temperature-sensitive CaTiO3 dielectric core between two FR4 substrates (r = 4.2), enabling enhanced electromagnetic field confinement and thermal frequency transduction. The sensor was fabricated using standard PCB processing techniques. For experimental characterization, the fabricated device was placed on a heating plate and interrogated wirelessly through a rectangular waveguide antenna connected to a vector network analyzer via a coaxial-to-waveguide converter. The compact sensor (36 mm × 36 mm × 3 mm) demonstrates stable operation over 25 °C–125 °C with 1.6 MHz °C−1 temperature-to-frequency resolution. The experimental results validate the design’s immunity to metallic interference while maintaining quadratic response characteristics (R2 = 0.999935) across the operational range. This study demonstrates the feasibility of the sandwich SIW sensor and its broad application prospects for wireless temperature measuring.
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