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Optimizing thermal management for airborne electronics using flexible phase change materials combined with fin-enhanced air cooling
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DOI：10.1016/j.applthermaleng.2026.132750.png)
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Abstract
En 中文
• Non-uniform dynamic thermal loads caused 83.0 °C peak and 30.6% time above 70 °C. • Flexible PCM-fin hybrid cooling reduced surface peak temperature by 23.0 °C. • Dynamic air supply improved temperature-energy cost ratio (TER) by 1.0 °C/(kW·h). • Three-level air strategy boosted TER by 0.5 °C/(kW·h) versus two-level strategy.
Keywords:
Airborne electronic equipment
Dynamic air supply
Flexible phase change material
Non-uniform and dynamic thermal loads
Thermal management optimization
Journal
IF:
6.9
Papers:
2.6W
Citations:
10.6W
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