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Polyimide-Based High-Temperature Plastic Electronics

delete2019-06-07
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PRE
AI
A
Aristide Gumyusenge
X
Xuyi Luo
Z
Zhifan Ke
D
Dung T. Tran
J
Jianguo Mei *
DOI:10.1021/acsmaterialslett.9b00120delete
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Abstract

Abstract

En 中文
All-plastic transistor devices with thermal stability up to 220 degrees C are demonstrated. We employ polyimide substrates, polyimide dielectrics, and a polyimide-based semiconducting blend to achieve flexible and thermally-robust transistors. An in situ temperature-dependent charge transport study was used to demonstrate that these devices can operate in extremely high temperatures and can sustain prolonged baking. Our devices maintained stable charge-transport characteristics with charge mobilities of 0.20 cm(2)/(V s), I-ON/T-OFF of 10(4), threshold voltage of 3 V, and operational voltage of 10 V when baked at 195 degrees C for 2 h.
Keywords:
ORGANIC TRANSISTORS
CHARGE-TRANSPORT
FILMS
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Journal

ACS Materials Letters cover
ACS Materials Letters
IF:
8.7
Papers:
2.1K
Citations:
1.2W

Organization

Purdue University System cover
Purdue University System
Scholars:
3.9W
Papers: 3.6W
Citations: 66