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Quasi-in-situ study on the effects of Sn grain orientation on Cu diffusion, IMC evolution and shear properties of Cu/Sn-0.7Cu-xZn/Cu joints under temperature gradient
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DOI：10.1016/j.msea.2026.150901.png)
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Abstract
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• Quasi-in-situ study reveals coupled effects of Zn & Sn orientation on TM behavior. • β-Sn grain orientation significantly governs thermomigration in low-Zn joints. • Zn addition markedly suppresses Cu diffusion and asymmetric IMC growth under TG. • High Zn content (≥3 wt%) weakens the dependence of TM on β-Sn grain orientation. • Zn alloying and large θ angle enhance shear strength via reinforcing bulk IMCs.
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3.7W
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13.8W
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