Reliability analysis and layout optimization for a multi-component system with thermal coupling

Dong Xu

doi:10.1016/j.ress.2025.111348

Reliability analysis and layout optimization for a multi-component system with thermal coupling

2025-06-25

0

PRE

AI

DOI：10.1016/j.ress.2025.111348

Original

Original request for help

Save

Abstract

En 中文

• Reliability models were proposed for systems with thermally coupled components. • The system layout was optimized based on component workload to enhance reliability. • The system volume was minimized with a reliability constraint.

Reliability analysis and layout optimization for a multi-component system with thermal coupling

Abstract

Journal

Organization

Cited Papers