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Roadmap for electrocaloric films characterization
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DOI：10.1016/j.isci.2026.115965.png)
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Abstract
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• Thick-film structures were simulated targeting maximized caloric response • Substrates with low thermal effusivity (≤3 kW s1/2 m−2 K−1) are suitable • Substrates with low thermal conductivity (≤1 W K−1 m−1) are suitable • Numerical simulations for infrared-based caloric measurements were performed
Keywords:
simulation in materials science
materials characterization techniques
films
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