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Second Generation Small Pixel Technology Using Hybrid Bond Stacking
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DOI：10.3390/s18020667.png)
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Abstract
En 中文
In thiswork, OmniVision's second generation (Gen2) of small-pixel BSI stacking technologies is reviewed. The key features of this technology are hybrid-bond stacking, deeper back-side, deep-trench isolation, new back-side composite metal-oxide grid, and improved gate oxide quality. This Gen2 technology achieves state-of-the-art low-light image-sensor performance for 1.1, 1.0, and 0.9 mu m pixel products. Additional improvements on this technology include less than 100 ppm white-pixel process and a high near-infrared (NIR) QE technology.
Keywords:
CIS
BSI
stacked
hybrid-bond
1.0 mu m
0.9 mu m
NIR
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