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Si-photonics based passive device packaging and module performance

delete2011-08-30
delete15
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OA
AI
J
Jeong Hwan Song *
J
Jing Zhang
张慧娟 cover
张慧娟 (Huijuan Zhang)
C
Chao Li
G
G. Q. Lo
DOI:10.1364/OE.19.018020delete
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Abstract

Abstract

En 中文
We report a fully packaged silicon passive waveguide device designed for a tunable filter based on a ring-resonator. Polarization diversity circuits prevent polarization dependant issues in the silicon ring-resonator. For the device packaging, the YAG laser welding technique has been used for pigtailing both of the input and output fibers. Post welding misalignment was compensated by mechanical fine tuning using the seesaw effect via power monitoring. Packaging loss less than 1.5dB with respect to chip measurement has been achieved using 10 mu m-curvature radius lensed fibers. In addition, the packaging process and the module performance are presented. (C) 2011 Optical Society of America
Keywords:
WAVE-GUIDES
FIBERS
COUPLERS
DESIGN

Journal

Optics Express cover
Optics Express
IF:
3.3
Papers:
6.1W
Citations:
14.3W

Organization

A
agency for science technology & research (a*star)
Scholars:
2.2W
Papers: 1.9W
Citations: 57