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Stable and realistic crack pattern generation using a cracking node method

delete2018-06-23
delete5
PRE
AI
J
Juan Zhang
段
段福庆 (Fuqing Duan)
M
Mingquan Zhou *
D
Dongcan Jiang
X
Xuesong Wang
Z
Zhongke Wu
Y
Youliang Huang
G
Guoguang Du
刘绍龙 cover
刘绍龙 (Shaolong Liu)
P
Pengbo Zhou
X
Xiangang Shang
DOI:10.1007/s11704-016-5511-9delete
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Abstract

Abstract

En 中文
This paper presents a method for simulating surface crack patterns appearing in ceramic glaze, glass, wood and mud. It uses a physically and heuristically combined method to model this type of crack pattern. A stress field is defined heuristically over the triangle mesh of an object. Then, a first-order quasi-static cracking node method (CNM) is used to model deformation. A novel combined stress and energy combined crack criterion is employed to address crack initiation and propagation separately according to physics. Meanwhile, a highest-stress-first rule is applied in crack initiation, and a breadth-first rule is applied in crack propagation. Finally, a local stress relaxation step is employed to evolve the stress field and avoid shattering artifacts. Other related issues are also discussed, such as the elimination of quadrature sub-cells, the prevention of parallel cracks and spurious crack procession. Using this method, a variety of crack patterns observed in the real world can be reproduced by changing a set of parameters. Consequently, our method is robust because the computational mesh is independent of dynamic cracks and has no sliver elements. We evaluate the realism of our results by comparing them with photographs of real-world examples. Further, we demonstrate the controllability of our method by varying different parameters.
Keywords:
crack pattern generation
fracture simulation
physically-based
extend finite element method
crack node method

Journal

Frontiers of Computer Science cover
Frontiers of Computer Science
IF:
4.6
Papers:
1.6K
Citations:
2.8K

Organization

B
Beijing Normal University
Scholars:
3.3W
Papers: 2.7W
Citations: 4.2W
P
peking university
Scholars:
11.9W
Papers: 8.7W
Citations: 146
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