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Stitch-Less Lithography Empowered by Multi-Dimensional Holography
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DOI：10.3390/nano16110692.png)
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Abstract
En 中文
Trends in Micro- and Nano-Lithography required for future development of large area applications ranging from high-packing-density electronics to solar cells are surveyed and outlined. Strategies to use direct laser writing to define etch masks over large areas by: (i) fixed beam moving stage and (ii) moving beam moving stage approaches are presented. The extension of planar 2D and stacked 2D (or 2.5D) fabrication methods into 3D micro- and nano-fabrication is discussed. One of the essential future characteristics of 3D nanolithography is real-time feedback capability. This can be realised via inherent 3D-capable holography, which bridges lithographic exposure control, wavefront sensing, and adaptive feedback, providing a pathway to stitch-free, large-area 3D patterning. The future of micro-fabrication is expected to evolve via highly specialised 3D architecture design and reduction in post-processing steps.
Keywords:
stitching-less lithography
resolution
feature size
threshold effect
diffraction limit
microfabrication
3D
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