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Stretchable and adhesive bilayers for electrical interfacing

delete2025-01-01
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PRE
AI
S
Song Yuli
陈凯 (Kai Chen)
S
Shimeng Chen
L
Linyuan Zhang
Y
Yaqiang Wang
吴凯 (Kai Wu)
C
Canhua Xu *
B
Bo Li *
J
Jinyu Zhang
G
Gang Liu
孙俊 cover
孙俊 (Jun Sun)
DOI:10.1039/d4mh01166jdelete
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Abstract

Abstract

En 中文
Integrated stretchable devices, containing soft modules, rigid modules, and encapsulation modules, are of potential use in implantable bioelectronics and wearable devices. However, such systems often suffer from electrical deterioration due to debonding failure at the connection between rigid and soft modules induced by severe stress concentration, limiting their practical implementation. Here, we report a highly conductive and adhesive bilayer interface that can reliably connect soft-soft modules and soft-rigid modules together by simply pressing without conductive pastes. This interface configuration features a nanoscale styrene-ethylene-butylene-styrene (SEBS) elastomer layer and a SEBS-liquid metal (LM) composite layer. The top SEBS layer enables a strong adhesion with different modules. The connections between soft-soft and soft-rigid modules can be stretched to high strains of 400% and 250%, respectively. Coupling electron tunneling through an ultrathin SEBS layer with LM particle networks in a SEBS-LM composite layer renders continuous pathways for electrical conductivity. Such a bilayer interface exhibits a strain-insensitive high conductivity (3.7 x 105 S m-1) over a wide strain range from 0 to 680%, which can be facilely fabricated in a self-organized manner by sedimentation of LM particles. We present a proof-of-concept demonstration of this bilayer interface as an electrode, interconnect, and self-solder for monitoring physiological signals.
Keywords:
PARTICLE-WALL COLLISIONS
SKIN
ELECTRONICS
SENSORS
CONDUCTORS
HYDROGELS

Journal

Materials Horizons cover
Materials Horizons
IF:
10.7
Papers:
3.6K
Citations:
2.4W

Organization

X
Xi'an Jiaotong University
Scholars:
1.2W
Papers: 4.4K
Citations: 8.4W
F
Fourth Mil Med Univ
Scholars:
1.7K
Papers: 400
Citations: 111