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Study of temperature rise suppression methods using high thermal conductivity filler-blended silicone materials in sealing-material-free crystalline silicon solar cell module structures
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DOI：10.1016/j.solmat.2026.114558.png)
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Abstract
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• In this paper, we present the results of our research on a useful method for providing the heat-dissipation mechanism necessary for the practical application of encapsulant-free solar cell modules. A new material with high heat-dissipation performance was developed for the cell bottom to enhance heat dissipation. Because this new material requires high coating performance, it was based on versatile liquid silicone and mixed with a separate thermally conductive filler, making it suitable for use in solar cell modules. In this research, a new material with high heat-dissipation performance was developed for the cell bottom to enhance heat dissipation. Because this new material requires high coating performance, it was based on versatile liquid silicone and mixed with a separate thermally conductive filler, making it suitable for use in solar cell modules.
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