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Surface and Interfacial Engineering for Multifunctional Nanocarbon Materials

delete2025-01-09
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PRE
AI
Y
Yuxuan Sun
C
Chuanbing Li
刘丹 cover
刘丹 (Dan Liŭ)
F
Fei Zhang
J
Jie Xue
Q
Qingbin Zheng
DOI:10.1021/acsnano.4c14128delete
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Abstract

Abstract

En 中文
Multifunctional materials are accelerating the development of soft electronics with integrated capabilities including wearable physical sensing, efficient thermal management, and high-performance electromagnetic interference shielding. With outstanding mechanical, thermal, and electrical properties, nanocarbon materials offer ample opportunities for designing multifunctional devices with broad applications. Surface and interfacial engineering have emerged as an effective approach to modulate interconnected structures, which may have tunable and synergistic effects for the precise control over mechanical, transport, and electromagnetic properties. This review presents a comprehensive summary of recent advances empowering the development of multifunctional nanocarbon materials via surface and interfacial engineering in the context of surface and interfacial engineering techniques, structural evolution, multifunctional properties, and their wide applications. Special emphasis is placed on identifying the critical correlations between interfacial structures across nanoscales, microscales, and macroscales and multifunctional properties. The challenges currently faced by the multifunctional nanocarbon materials are examined, and potential opportunities for applications are also revealed. We anticipate that this comprehensive review will promote the further development of soft electronics and trigger ideas for the interfacial design of nanocarbon materials in multidisciplinary applications.
Keywords:
nanocarbon materials
surface engineering
interfacial engineering
functionalization
interfacialwelding
wettability
physical sensing
thermal management
electromagnetic interference shielding

Journal

ACS Nano cover
ACS Nano
IF:
16
Papers:
2.6W
Citations:
25.6W

Organization

C
Chinese Univ Hong Kong
Scholars:
2.6K
Papers: 1.6K
Citations: 662