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Synergistic mechanism between interfacial bonding and geometry-driven compression in glass-to-metal seals

delete2026-05-15
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PRE
AI
Z
Zhou, Chao
K
Keqian Gong
S
Song, Zifeng
N
Nie, Siyue
S
Shi, Zhangjing
Z
Zhang, Yong *
DOI:10.1016/j.jnoncrysol.2026.124064delete
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Abstract

Abstract

En 中文
Glass-to-metal (GTM) seals are essential for high-reliability components in electrical and energy systems, yet their performance is jointly governed by interfacial bonding and structural constraints. The conventional compression rule, based solely on thermal-expansion matching, fails to fully explain the stability of seals with reversed thermal-expansion sequences. Herein, concentric GTM assemblies composed of borosilicate glass, a 304 stainless steel (304SS) outer shell, and Fe-Ni pin alloys (4J42 and 4J58) were investigated to elucidate the coupling between interfacial reactions and geometry-driven compression. By adjusting the metal pre-oxidation conditions and combining microstructural and residual stress analyses, the results clarify the role of oxidation kinetics and stress redistribution in determining sealing performance. Moderate oxidation promotes the formation of a compact, adherent interfacial layer, enhancing bonding integrity, whereas excessive or insufficient oxidation leads to interfacial degradation. Residual stress analyses reveal that the glass remains fully compressive under a shell-dominated constraint, despite differences in thermal-expansion polarity. These findings establish a dual-path framework in which macroscopic geometric confinement and microscopic interfacial accommodation act synergistically to ensure mechanical stability. This coupling mechanism provides new insights and design guidance for achieving robust GTM seals under complex or non-ideal thermal conditions.
Keywords:
Glass-to-metal seal
Fe-Ni alloy
Interfacial oxidation
Residual stress
Thermal-expansion mismatch

Journal

Journal of Non-Crystalline Solids cover
Journal of Non-Crystalline Solids
IF:
3.5
Papers:
1.9W
Citations:
3.3W

Organization

T
tsinghua university
Scholars:
11.5W
Papers: 9.9W
Citations: 137
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