logo
CanyamAI summaries for academic research
language
MobileMobile
  • Phone FeatureWeChat Mini Program
EnglishEnglish
noticeNotice
BlogBlog
delete
arrow
Return

System integration for mobile communications

delete2001-10-01
delete0
PRE
AI
H
H. Reichl *
J
J.K. Wolf
DOI：10.1002/1527-2648(200110)3:10<803::AID-ADEM803>3.0.CO;2-Wdelete
deleteOriginal
deleteOriginal request for help
deleteShare
deleteSave
Abstract

Abstract

En 中文
The research and development of electronic products is currently in a phase of upheaval. Microsystem technologies are the basis to realize highly miniaturized systems with varied functions, which were unthinkable a few years ago. Packaging technology plays a key role in the realization of this new generation of products. This requires the development of new technologies and materials, as well as new design software and the integration of electrical and electromechanical simulations at the stage of the system design.
AI Summary

AI Summary

Key information extracted from the uploaded paper, including a brief overview, abstract, background, key highlights, visual analysis, and future outlook.

Journal

Advanced Engineering Materials cover
Advanced Engineering Materials
IF:
3.3
Papers:
9.2K
Citations:
2.2W

Organization

No organization information available