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TEC power consumption in laser array packaging
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DOI：10.1007/s11082-017-0976-9.png)
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Abstract
En 中文
In this paper, we developed a 3-D thermal model of a modulator-and amplifier-integrated distributed feedback laser array with detailed heat sources based on finite element method. Thermoelectric cooler (TEC) power consumption in the laser array package was analyzed and we found that it was severe in high temperature environment. To reduce the TEC power consumption, circumstances of using different submount materials and using different stages of TECs were simulated. In hot environment, the laser array using an AlN-SiC two-stage submount has a decrease of 48% in the TEC power consumption comparing with an AlN-kovar submount. And the TEC power consumption can be reduced up to 39.7% by using a two-stage TEC instead of a single one. The thermal performance of the laser array can be improved by selecting proper submount materials and using suitable TECs. These results might be useful for optoelectronic device packaging with a similar thermal system.
Keywords:
TEC
Laser array
Thermal management
Semiconductor device packaging
FEM
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