arrow
Return

Technology Prospects for Data-Intensive Computing

delete2023-01-01
delete10
PRE
AI
K
Kerem Akarvardar *
W
Wong, H-S Philip
DOI:10.1109/JPROC.2022.3218057delete
deleteOriginal
deleteOriginal request for help
deleteShare
deleteSave
Abstract

Abstract

En 中文
For many decades, progress in computing hardware has been closely associated with CMOS logic density, performance, and cost. As such, slowdown in 2-D scaling, frequency saturation in CPUs, and increased cost of design and chip fabrication for advanced technology nodes since the early 2000s have led to concerns about how semiconductor technology may evolve in the future. However, the last two decades have also witnessed a parallel development in the application landscape: the advent of big data and consequent rise of data-intensive computing, using techniques such as machine learning. In this article, we advance the idea that data-intensive computing would further cement semiconductor technology as a foundational technology with multidimensional pathways for growth. Continued progress of semiconductor technology in this new context would require the adoption of a system-centric perspective to holistically harness logic, memory, and packaging resources. After examining the performance metrics for data-intensive computing, we present the historical trends for general-purpose graphics processing unit (GPGPU) as a representative data-intensive computing hardware. Thereon, we estimate the values of the key data-intensive computing parameters for the next decade, and our projections may serve as a precursor for a dedicated technology roadmap. By analyzing the compiled data, we identify and discuss specific opportunities and challenges for data-intensive computing hardware technology.
Keywords:
Artificial intelligence (AI)
AI accelerators
big data applications
CMOS technology
deep learning
DRAM chips
energy efficiency
high performance computing
machine learning
Moore's Law
multichip modules (MCMs)
nonvolatile memory
roadmaps (technology planning)
SRAM chips
system integration
system-in-package (SiP)
system-on-chip
three-dimensional integrated circuits
wafer bonding

Journal

Proceedings of the IEEE cover
Proceedings of the IEEE
IF:
25.9
Papers:
9.9K
Citations:
4.5W

Organization

T
taiwan semiconductor manufacturing company
Scholars:
569
Papers: 289
Citations: 0
Cited Papers

Cited Papers

errShare
errSave
errShare
errSave
Geometrical Structures of Partially Oxidized Rhodium Cluster Cations, Rh6Om+ (m = 4, 5, 6), Revealed by Infrared Multiple Photon Dissociation Spectroscopy
err2016-10-21
err0
errOAAI
errKohei Koyama; Toshiaki Nagata; Satoshi Kudoh; Ken Miyajima; Douwe M. M. Huitema; Valeriy Chernyy; Joost M. Bakker; Fumitaka Mafuné
errShare
errSave
Development of a Large-Scale Copper(I)/TEMPO-Catalyzed Aerobic Alcohol Oxidation for the Synthesis of LSD1 Inhibitor GSK2879552
err2018-10-25
err0
PREAI
errAugustine Ochen; Robert Whitten; Helen E. Aylott; Katie Ruffell; Glynn D. Williams; Fiona Slater; Andrew Roberts; Paul Evans; Janelle E. Steves; Mahesh J. Sanganee
errShare
errSave
researcher View more